三维单芯片多处理器温度特性

Temperature Characteristics of Three-dimensional Chip-multiprocessors

  • 摘要: 给出热阻矩阵的表达式,研究三维单芯片多处理器(3D CMP,three-dimensional chip-multiprocessor)的温度特性,通过Matlab分析热容、热阻和功耗对温度的影响.结果表明:减小热阻和功耗可以有效约束3D-CMP的稳态温度;热容增大可以导致3D-CMP温度上升时间变长,但不影响其最终稳态温度.

     

    Abstract: An expression of thermal resistance matrix is given.Transient temperature characteristics of three-dimensional chip-muhiprocessors(3D-CMP) are studied.Effect of heat capacity,thermal resistance and power consumption on temperature is analyzed. It shows that steady temperature of 3D-CMP is limited effectively by reducing thermal resistance and power consumption.Heat capacity influences rise time of temperature.It does not affect steady temperature.

     

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