分子动力学模拟铜薄膜的热导率

MOLECULAR DYNAMICS SIMULATION TO THE THERMAL CONDUCTIVITY OF COPPER THIN-FILM

  • 摘要: 采用分子动力学(MD)方法模拟铜薄膜的热导率,给出了厚度在100~400nm、温度在100~600K范围内铜薄膜热导率对尺寸及温度的依赖关系.

     

    Abstract: Thermal conductivity of copper films is simulated using the molecular dynamics.Size and temperature dependent effects of the films with 100~400nm thickness at 100~600K temperature are summarized according to the simulation.

     

/

返回文章
返回