Temperature Characteristics of Three-dimensional Chip-multiprocessors

WANG Fengjuan; YANG Yintang; ZHU Zhangming; WANG Ning; ZHANG Yan

WANG Fengjuan, YANG Yintang, ZHU Zhangming, WANG Ning, ZHANG Yan. Temperature Characteristics of Three-dimensional Chip-multiprocessors[J]. Chinese Journal of Computational Physics, 2012, 29(6): 938-942.

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Temperature Characteristics of Three-dimensional Chip-multiprocessors

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An expression of thermal resistance matrix is given.Transient temperature characteristics of three-dimensional chip-muhiprocessors(3D-CMP) are studied.Effect of heat capacity,thermal resistance and power consumption on temperature is analyzed. It shows that steady temperature of 3D-CMP is limited effectively by reducing thermal resistance and power consumption.Heat capacity influences rise time of temperature.It does not affect steady temperature.

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